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ACS03MS
January 1996
Radiation Hardened Quad 2-Input NAND Gate with Open Drain
Pinouts
14 PIN CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR CDIP2-T14, LEAD FINISH C TOP VIEW
A1 1 14 VCC 13 B4 12 A4 11 Y4 10 B3 9 A3 8 Y3
Features
* Devices QML Qualified in Accordance with MIL-PRF-38535 * Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96703 and Intersil's QM Plan * 1.25 Micron Radiation Hardened SOS CMOS * Total Dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300K RAD (Si) * Single Event Upset (SEU) Immunity: <1 x 10-10 Errors/Bit/Day (Typ) * SEU LET Threshold . . . . . . . . . . . . . . . . . . . . . . . >100 MEV-cm2/mg * Dose Rate Upset . . . . . . . . . . . . . . . . >1011 RAD (Si)/s, 20ns Pulse * Dose Rate Survivability . . . . . . . . . . . >1012 RAD (Si)/s, 20ns Pulse * Latch-Up Free Under Any Conditions * Military Temperature Range . . . . . . . . . . . . . . . . . . -55oC to +125oC * Significant Power Reduction Compared to ALSTTL Logic * DC Operating Voltage Range . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V * Input Logic Levels - VIL = 30% of VCC Max - VIH = 70% of VCC Min * Input Current 1A at VOL, VOH * Fast Propagation Delay . . . . . . . . . . . . . . . . 15ns (Max), 10ns (Typ)
B1 2 Y1 3 A2 4 B2 5 Y2 6 GND 7
14 PIN CERAMIC FLATPACK MIL-STD-1835 DESIGNATOR CDFP3-F14, LEAD FINISH C TOP VIEW
A1 B1 Y1 A2 B2 Y2 GND 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VCC B4 A4 Y4 B3 A3 Y3
Description
The Intersil ACS03MS is a Radiation Hardened quad 2-input NAND gate with open drain outputs. The open drain output can drive resistive loads from a separate supply voltage. The ACS03MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of a radiation hardened, high-speed, CMOS/SOS Logic Family. The ACS03MS is supplied in a 14 lead Ceramic Flatpack (K suffix) or a Ceramic Dual-In-Line Package (D suffix).
Ordering Information
PART NUMBER 5962F9670301VCC 5962F9670301VXC ACS03D/Sample ACS03K/Sample ACS03HMSR TEMPERATURE RANGE -55oC to +125oC -55oC to +125oC 25oC 25oC 25oC SCREENING LEVEL MIL-PRF-38535 Class V MIL-PRF-38535 Class V Sample Sample Die PACKAGE 14 Lead SBDIP 14 Lead Ceramic Flatpack 14 Lead SBDIP 14 Lead Ceramic Flatpack Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999
Spec Number File Number
1
518779 3064.1
ACS03MS Functional Diagram
An Yn
Bn
TRUTH TABLE INPUTS An L L H H NOTES: 1. L = Low, H = High, Z = High Impedance 2. Without Pull-up Resistor 3. With Pull-up Resistor Bn L H L H OUTPUT Yn Z (Note 2), H (Note 3) Z (Note 2), H (Note 3) Z (Note 2), H (Note 3) L
Spec Number 2
518779
ACS03MS Die Characteristics
DIE DIMENSIONS: 68 mils x 79 mils 1730mm x 2010mm METALLIZATION: Type: AlSi Metal 1 Thickness: 7.125kA 1.125kA Metal 2 Thickness: 9kA 1kA GLASSIVATION: Type: SiO2 Thickness: 8kA 1kA WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 110m x 110m 4.3 mils x 4.3 mils
Metallization Mask Layout
ACS03MS
B1 (2) A1 (1) VCC (14) B4 (13)
Y1 (3)
(12) A4
A2 (4)
(11) Y4
B2 (5) (10) B3
Y2 (6)
(9) A3
(7) GND
(8) Y3
Spec Number 3
518779
ACS03MS
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029
Spec Number 4

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